EMI/RFI SHIELDING AND THERMAL MANAGEMENT MATERIALS
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26  |
26 CONDUCTIVE JACKET OVER FOAM GASKETING
Economical Shielding for Door and Enclosure Seals. Low Closure Force EMI Seals for Electronic Equipment Standard and Custom Profiles Pressure Sensitive Adhesive.
GENERAL PROPERTIES
Temp Range (C) -40 to 70
Typically requires <1 lb/in. Closure Force
Compression Set <25%
>90 db Attenuation from 20 MHz to 10 Ghz
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29  |
29 COMBINATION GASKETS
Gasket Applications requiring both a Weather Resistant Seal along with EMI Shielding. Can be Spliced into Complete Gaskets.
GENERAL PROPERTIES
Mesh Material: Monel
Sponge Material: Neoprene
Sponge Density: Medium
Temp Range (F) -40 to 200
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27  |
27 CONDUCTIVE EXTRUSIONS
High Performance Extruded
EMI Shielding Profiles
Standard and Custom Profiles
Can be Kiss-Cut w/PSA
GENERAL PROPERTIES
Filler and Binder: Silver Plated Glass in Reticulate Silicone.
10 - 100 db Shielding Effectiveness
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30  |
30 THERMALLY CONDUCTIVE PADS
Excellent Thermal Conductivity
Fills in Air Gaps for Improved Heat Dissipation
Applications include Laptop Computers and Automotive Electronics Packages.
GENERAL PROPERTIES
Composition: Aluminum Oxide Filled Silicone on Aluminum Foil Carrier
Thermal Impedance: (C in2/w@10 PSI) 1.1
Color - Light Purple
Temp Range (C) -55 to 200
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28  |
28 CONDUCTIVE SHEET
Excellent EMI Shielding
Gaskets and Seals for Electronic Equipment
Easy to Die Cut
GENERAL PROPERTIES
Conductive Filler: Ni/C
Elastomer: Silicone Volume
Resistivity: .1 ohm/cm
Durometer: 55 +/- 10
Temp Range (C) -45 to 150
>90 db Attenuation from 100Mhz to 10 GHz
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Material List
Dense Rubber/Matting Materials
